Dongguan JinYan Precision Grinding Machinery Manufacturing Co., Ltd.

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    • Semiconductor Lapping and Polishing Series Semiconductor Lapping and Polishing Series

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Several forms of the double-sided grinding machine processing method

2025-09-01

Several forms of the double-sided grinding machine processing method

Dry grinding: During grinding, simply apply a small amount of lubricating additive to the surface of the grinding tool.

Details of the fine-tuning process for the double-sided grinding machine method

2025-09-01

Details of the fine-tuning process for the double-sided grinding machine method

Dry grinding: During the process, only a small amount of lubricant additive needs to be applied to the surface of the grinding tool. The abrasive grains remain largely fixed to the tool throughout grinding, with the primary cutting action occurring through sliding abrasion. While this method isn’t highly productive, it achieves exceptional machining accuracy and produces surfaces with extremely low roughness values (Ra 0.02–0.01 μm).

Operating environment conditions for the polishing machine used in processing light guide plate molds

2025-09-01

Operating environment conditions for the polishing machine used in processing light guide plate molds

The light guide plate mold polishing machine boasts exceptionally high processing efficiency—its output in a single shift exceeds the daily production of over 30 workers.

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Dongguan JinYan Precision Grinding Machinery Manufacturing Co., Ltd.

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+86-769-8112 1242

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Web: www.kizicn.com

Address: Building 1, No. 18, Erh Road, Dangkeng, Liaobu Town, Dongguan City, Guangdong Province

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    • Semiconductor Lapping and Polishing Series

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