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Semiconductor Lapping and Polishing Series
Single-Side Lapping and Polishing Machine
Double-sided Lapping and Polishing Machine
Fully Automatic Single and Double-Side Grinding Series
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2025-09-01
Several forms of the double-sided grinding machine processing method
Dry grinding: During grinding, simply apply a small amount of lubricating additive to the surface of the grinding tool.
Details of the fine-tuning process for the double-sided grinding machine method
Dry grinding: During the process, only a small amount of lubricant additive needs to be applied to the surface of the grinding tool. The abrasive grains remain largely fixed to the tool throughout grinding, with the primary cutting action occurring through sliding abrasion. While this method isn’t highly productive, it achieves exceptional machining accuracy and produces surfaces with extremely low roughness values (Ra 0.02–0.01 μm).
Operating environment conditions for the polishing machine used in processing light guide plate molds
The light guide plate mold polishing machine boasts exceptionally high processing efficiency—its output in a single shift exceeds the daily production of over 30 workers.