Frequently Asked Questions

There is a growing trend in engineering equipment to gradually replace some metal components with ceramic materials. However, ceramics have one significant drawback: their inherent brittleness makes them difficult to machine using conventional double-sided grinding techniques. Currently, most applications of engineering ceramics involve pre-formed parts, and among these, flat-surface machining via double-sided grinding has become the most established method. Many components made from engineering ceramics are produced by pressing and sintering processes, with the primary surfaces typically being flat. While single-sided grinding is the standard approach for machining these flat surfaces, certain ceramic parts require simultaneous double-sided grinding to meet stringent quality standards.

The abrasive material included inside the double-sided grinder is a mixture of abrasives combined with water or oil, among other substances. Depending on the hardness of the workpiece and the desired machining allowance, different grades of abrasives can be selected. Abrasives are classified into natural and synthetic types based on their origin. Natural abrasives include materials like diamond, corundum, and garnet, while synthetic abrasives encompass options such as synthetic diamond, synthetic corundum, silicon carbide, and boron carbide.

Corundum is a crystalline form of aluminum oxide (Al₂O₃). Natural corundum has a specific gravity ranging from 3.9 to 4.0, while synthetic corundum typically falls between 3.2 and 4.0. Aluminum oxide exhibits remarkable toughness, with a Vickers hardness rating exceeding approximately 2000.

To achieve the highest possible polishing rate, the silicon wafer polisher must efficiently remove the damage layer created during the grinding process as quickly as possible. At the same time, it’s crucial to ensure that the polished damage layer doesn’t compromise the final microstructure observed—preventing the formation of "false structures." The former goal calls for using coarser abrasives, which guarantee a faster polishing rate and effectively eliminate the grinding-induced damage layer. Meanwhile, the latter requires employing the finest materials available, resulting in a shallower polished damage layer—but at the expense of a slower polishing rate. To optimize contact between the polishing head and the work surface, the distance between them must be carefully adjusted, ensuring the best possible performance and the highest-quality finish. Additionally, during the polishing process, manual waxing can be employed to further reduce machine production costs.

Silicon wafer polishing machines can also handle curved surfaces, and sanitary ware and metal hardware handles often demand high precision during the polishing process—making the quality of the polishing machine itself crucial. The number, weight, and size of the workpieces all play a significant role in the process: as more pieces are added gradually, the rotation speed should be slowed down accordingly. However, the workpieces must not come to a complete stop. If they do, the resulting polished product will end up uneven, and the polishing time could unnecessarily extend as well. Key operational tip: Before starting the silicon wafer polishing process, ensure that any oil or grease on the workpiece surfaces has been thoroughly cleaned. Polishing fluids alone cannot effectively remove heavy oil buildup—otherwise, the workpieces, polishing pins, water, and even the polishing barrel may turn black. Always use a dedicated cleaning solution when maintaining and rinsing the polishing pins and the polishing barrel.

Human-machine intelligence in polishing the China control system

Generally, polished optical fibers have core diameters of 5–15 μm for single-mode fibers and 40–100 μm for multi-mode fibers, with cladding diameters typically ranging from approximately 125 to 600 μm. Ideally, the treated fiber end face should form a smooth, flat surface. However, in practice, fiber end-face processing often falls short of this ideal—issues like imperfect polishing, scratches, or even chipped or damaged surfaces and edges can significantly complicate the situation. For coupling fibers with other components in lasers or for splicing fibers together, it is crucial that the fiber ends maintain a perfectly smooth and even surface; otherwise, transmission losses will inevitably increase.

The Polishing China control system uses a PLC as its core controller, with a text display serving as the human-machine interface for interaction. This intuitive and user-friendly interface allows operators to easily communicate with the system regarding equipment maintenance, operation status, and troubleshooting. The system features straightforward program control and simple operation, ensuring comprehensive safety measures—any unintended actions in non-normal states are automatically disabled. Additionally, the system provides real-time monitoring, promptly detecting faults or errors and issuing alerts, making maintenance tasks both efficient and convenient. Featuring acrylic rods and sheets, this advanced polishing process delivers exceptional results: after diamond polishing, no further cloth-wheel finishing is required. The finished surfaces exhibit a brilliant, crystal-clear shine (with sample pieces available for demonstration), achieving ultra-smooth, mirror-like finishes through precision surface cutting. This method also enhances light transmission properties, comparable to materials like organic glass, acrylic, light guide plates, and even crystal blocks—without the need for traditional polishing techniques such as cloth-wheel or flame polishing. As a result, a single Polishing China machine can replace the labor of 10 to 20 skilled workers traditionally required for these processes.

Silicon Wafer Polishing Machine: Humidity Sensor and Humidification Performance

To ensure the effectiveness of humidification in silicon wafer polishing machines, we’ve switched from the original water-injection method to an atomization-based humidification system. Currently, most domestically produced small- and medium-sized polishing machines still rely on the traditional water-injection method for humidification. However, since these machines require only a limited amount of moisture, this approach often leads to uneven distribution of humidity, which can negatively impact the quality of the polishing process. By adopting an atomization technique, we’ve virtually eliminated humidity inconsistencies, significantly enhancing the overall polishing performance. The water is atomized using high-frequency vibrations, and this type of atomization device is readily available on the market.

After turning on the silicon wafer polishing machine, carefully place the workpieces into the polishing barrel—starting with a small amount and gradually increasing the quantity. The number, weight, and size of the workpieces all play a crucial role in this process. Therefore, as you add more pieces, reduce the rotation speed of the barrel. However, never let the workpieces come to a complete stop. If the workpieces remain stationary while the barrel continues to rotate, the polishing solution will be applied unevenly across the surface, leading to inconsistent results and unnecessarily prolonging the polishing time.

We’ve selected a humidity sensor from our silicon wafer polishing machine—this sensor integrates sensing and signal transmission into one compact unit, making it lightweight, space-efficient, reasonably priced, and easy to install. The sensor’s standard voltage signal is routed to another channel, where it’s sampled by a microcontroller and converted into a digital signal. This digital signal is then compared against the preset humidity threshold, enabling precise control of the humidification solenoid valve—specifically, determining whether the valve should open or close. The system employs three types of solenoid valves—large, medium, and small—to regulate the humidification level. This approach not only simplifies the overall system design but also ensures reliable performance and enhanced control accuracy.

The mirror polishing machine industry is steadily advancing, driving the comprehensive development of fully automated polishing machines. As China aligns more closely with global standards, there’s an increasing imperative to continuously enhance the quality of polishing machines, while the demand for automation grows stronger than ever. Today, mirror polishing machines have become the best-selling products in the market.

The motor designed for the inverter is a variable-frequency-specific motor, enabling the motor to achieve different speeds and torques under the inverter's control, thus adapting to changing load requirements. In polishing and wire-drawing machines, using a standard AC motor paired with an inverter serves the purpose of adjusting the spindle speed while simultaneously reducing the inrush current during startup.

However, the maximum speed of a typical general-purpose AC motor is limited to 2,800 RPM. Plastic gears, on the other hand, maintain excellent dynamic balance—thanks to the even distribution of abrasive cloth and wire filaments fixed uniformly onto them—so they don’t compromise the gear’s overall stability. When higher speeds are required, especially with the need for adjustable rotational speed at any given moment, a variable-frequency (VFD) motor is the ideal choice. Ideally, the VFD should be paired with a dedicated VFD-compatible motor, as this setup not only ensures efficient forced cooling but also features uniquely designed stator and rotor windings tailored specifically to optimize the motor’s responsiveness and energy efficiency in tandem with the VFD. "Mirror polishing machines boost productivity by 7 to 8 times compared to manual operations," it was noted. "Beyond their impressive efficiency, these machines excel because their multi-angle rotation capability allows them to tackle even the most challenging, hard-to-reach areas that would otherwise remain untouched during manual polishing. As a result, mirror polishing machines deliver far more consistent, precise results—and that’s precisely why they’re predominantly used in the production of high-end, premium-quality products."

Plane polishing machines achieve mirror-like finishes on workpieces, but this result isn’t achieved in a single final polishing step. Instead, it requires multiple pre-processing stages, including coarse grinding, semi-fine grinding, and fine grinding. The lower the required surface roughness value for the workpiece, the more pre-grinding steps are needed before the final polishing with the plane polisher. Importantly, reducing surface roughness is a gradual process: coarser abrasive grains offer stronger cutting power and higher grinding efficiency, though they produce a relatively lower-quality surface finish. Conversely, finer abrasive grains deliver gentler cutting action, weaker cutting ability, and lower grinding efficiency—but they yield a much smoother, higher-quality surface finish. Therefore, to maximize grinding efficiency, when selecting abrasive grain sizes, it’s essential to follow a systematic approach: start with coarser grains for initial roughing, progress to progressively finer grades for intermediate stages, and finally settle on the finest grit for achieving the precise surface roughness specifications demanded by the workpiece.

Typically, when using a flat polishing machine, people tend to focus more on the polishing process and its results—often overlooking the crucial steps of cleaning and properly storing the finished workpiece afterward. It’s only when issues arise during storage that users suddenly realize the importance of these steps. By then, however, damage to the workpieces has already occurred, potentially harming the company’s interests. In fact, after polishing is complete on a flat machine, workpieces not only require careful cleaning but also thorough preservation. So, how can we ensure effective and safe storage? Take sapphire or smartphone glass as examples: After the final polishing step, it’s generally recommended to wrap the entire piece completely in a dust-free cloth before placing it into a box for storage. Why use a dust-free cloth? Ordinary cloths are often rough and may carry microscopic particles like dust on their surfaces, which could easily scratch the polished, mirror-like finish. In contrast, dust-free cloths are made from specialized materials designed to be lint-free and particle-free, ensuring maximum protection even if the workpiece experiences minor bumps or movements during handling. This is precisely why dust-free cloth is specifically prescribed for this purpose.

Due to the frequent replacement of broken extension rod connecting bolts, the flange surfaces of the extension rods have become uneven. Additionally, the surface of the press head on the hydraulic plate of the sapphire substrate grinder is also no longer perfectly smooth. As a result, during the pressing process, the load distribution on the bolts becomes uneven, increasing the risk of bolt bending under tension. Moreover, uneven tightening can lead to some bolts bearing excessive force, making them more prone to fracture during operation. Therefore, when the connecting flanges are uneven, they should be replaced promptly—and ideally, their material should possess high hardness and strength. When tightening the bolts, it’s crucial to use the hydraulic wrench correctly. The tightening sequence for the extension rod bolts must be carried out in three stages: first apply pressure up to 540 bar, then increase to 720 bar, and finally reach 960 bar. Applying full pressure in one go is strictly prohibited. The composite-function mold polishing machine integrates ultrasonic polishing with other conventional mold treatment techniques, making it a versatile, ultrasonic mold polisher that has become an essential and convenient tool for professionals involved in mold surface finishing.

The sapphire substrate grinding machine is the same size as the grinding wheel itself. The equipment’s grinding wheel can rotate at speeds up to 60 RPM, with an inner diameter of 310 mm and a thickness of approximately 15 mm. The correcting wheels have an outer diameter of 410 mm and an inner diameter of 360 mm, and the system requires three correcting wheels simultaneously. The maximum processing size must be smaller than 333 mm—any dimension exceeding this would necessitate a larger machine model. The motor delivers a power output of 7.5 kW, operates at 380 V, and is equipped with 3-phase power. Additionally, the cylinders can apply a maximum pressure of 200 kg, with three cylinders installed in total.