Precision CMP Polishing Machine
Precision CMP Polishing Machine

CMP Single-Side Polishing Machine

Product Features

  • Automatic switching discharge system for wastewater and waste liquid
  • Automatic constant temperature monitoring system

Scope of application

  • Semiconductor materials: Si, Ge, GaAs, sapphire, SiC, InP, GaN, MEMS, ceramic substrates, and more
  • Precision optics: optical crystals, optical lenses, glass substrates, ITO glass, sapphire glass, filtering materials, and more;
  • Crystal materials: lithium niobate, lithium tantalate, YAG, quartz, infrared materials, and more.

KD360S4

KD50QS4

Grinding plate size (mm)

ø910

Workpiece plate outer diameter (mm)

ø360

Grinding wheel speed (r.p.m.)

5-90

Main motor power (KW)

15

Air pressure (MPa)

0.6

Total Power (KW V1380V)

About 20

Gross weight (kg)

3650

External dimensions (W × D × H) mm

1360 x 1330 x 2650

Grinding plate size (mm)

Ø1270

Workpiece plate outer diameter (mm)

ø485

Grinding wheel speed (r.p.m.)

5-65

Main motor power (KW)

30

Air pressure (MPa)

0.6

Total Power (KW, V1380V)

About 38

Gross weight (kg)

7500

External dimensions (W × D × H) mm

1900 x 2600 x 2750