About Us
Business Advantages
Deeply cultivate development
The R&D team has continuously driven technological innovation, overcoming key technical challenges in areas such as sapphire, ultra-thin hard and brittle ceramic grinding and polishing—specifically in equipment, consumables, and process technologies. As a result, they’ve secured multiple proprietary technology patents. Notably, their silicon carbide wafer polishing equipment has successfully replaced foreign-imported brands and is now being widely applied with great success.
Technologically advanced
Over the years, the company has earned prestigious honors such as "Dongguan City Science and Technology Enterprise," "Guangdong Province Contract-Honoring and Trustworthy Enterprise," "Specialized, Fine, and New Enterprise," and "National High-Tech Enterprise." Its equipment and consumables are widely used in precision grinding and polishing processes for parts made of metals, non-metals (including ceramics, sapphire window slices and substrates, silicon carbide substrates, gallium nitride wafers, silicon wafers, and other semiconductor materials), etc. Workpieces can achieve an optimal flatness of 1μm and a roughness of 0.15nm.
Nationwide Unified Service Hotline
China Market E-mail: sales1@kizicn.com
International Market Email: sales2@kizicn.com
Web: www.kizicn.com
Address: Building 1, No. 18, Erh Road, Dangkeng, Liaobu Town, Dongguan City, Guangdong Province
Copyright 2025 Dongguan JinYan Precision Grinding Machinery Manufacturing Co., Ltd. All rights reserved
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